Process Engineer – Die / Wire bonding

General information Entity Safran is an international high-technology group, operating in the aviation (propulsion, equipment and interiors), defence and space markets. Its core purpose is to contribute to a safer, more sustainable world, where air transport is more environmentally friendly, comfortable and accessible. Safran has a global presence, with 83,000 employees and sales of 19 billion euros in 2022 and holds, alone or in partnership, world or regional leadership positions in its core markets. Safran undertakes research and development programs to maintain the environmental priorities of its R&T and innovation roadmap. Safran ranks among Forbes magazine's Top 30 best employers in the world.Safran Electronics & Defense is an international company with 10,000 employees, built on proven expertise in technologies that underpin sovereignty. By combining human and artificial intelligence, the company develops the products and services that empower aerospace and defence players to observe, decide and guide. Safran Electronics & Defense also supports fellow Safran companies by sharing its state-of-the-art electronics skills and expertise.    Reference Process Engineer – Die / Wire bonding -137595 Position descriptionDomainProductionJob field / Job profileIndustrial engineering - Assembly processes engineeringJob FamilyProcess EngineerJob titleProcess Engineer – Die / Wire bonding Secondary domain/Job field Materials and processes - Materials and process engineeringEmployment typePermanentPart time / Full timeFull-timeJob descriptionSafran Sensing Technologies Switzerland SA is a world leader in the design and production of silicon microsystems (MEMS). A subsidiary of the Safran Group, we are a human-sized company and place great value on the development of our employees. To support our growth, we wish to welcome, train and support the development of a Process Engineer.Travel specifictityYour main activities:• Guarantee and optimize manufacturing processes, and actively participate in the development of new processes for products under development• Lead packaging equipment selection, qualification, and process validation activities, ensuring alignment with quality standards and production goals.• Pilot the process transfer and define the surveillance process of our off-shore subcontracting partner (Asia)Additional descriptionRole based in Yverdon-les-Bains, Switzerland.Permanent contract, 80-100%, time flexibility, career development, equal opportunity employer.Candidate skills & requirementsYour background and knowledge:• Engineer in micro technology, microelectronics with experience in clean room in an industrial environment or any other experience deemed equivalent• Minimum 2 years' experience in assembly, wire bonding or lid sealing processes• In-depth knowledge and interest in data statistical analysis• Familiar with problem solving methods (8d, FMEA, brainstorming…). Lean manufacturing certification an asset.• Fluency in both French and EnglishYour personal profile:• Ability to work in a team and collaborate with other department, knows how to set objectives, motivate, and report• Responsible, reliable, organized, autonomous and solution-oriented• Open to travel in Europe and outside Europe (2 weeks per year)Position locationJob locationEurope, SwitzerlandCity (-ies)Av. des Sciences 13  1400  Yverdon-Les-BainsCandidate criteriaMinimum education level achievedMaster DegreeMinimum experience level requiredMore than 3 yearsAdditional Languages preferredFrench (Fluent)English (Fluent)